国家/地区 世界知识产权组织（4）
IPC部 C（4）
IPC大类 C08（4）
IPC小类 C08K（4） C08L（4） C09K（2）
IPC C08K003/04（4）
发明人 LEE E J（2） LEE K（2） LEE K D（2）
NAM C R（2） SEO M K（2） SONG J（2）
SONG J H（2）
公开年 2023（4）
申请年 2022（4） 
专利权人 HANSOL CHEM .（2）

Electromagnetic interference suppressing material used as radio wave absorber, noise suppression sheet, semiconductor sealing material, sealing sheet, and wire coating material, comprises base material containing organic substances and inorganic substances, and powdered carbon material.

NISHIHARA H, YOSHIDA S, UCHIDA K

Composition used for forming coating material, comprises curable resin and/or its precursor, inorganic particles, and graphene having preset average thickness.

KATO T, TAMAKI E

Heat dissipation composite composition used for forming heat dissipation composite, comprises epoxy resin, and phase change material, and includes polymer matrix formed by chemical bonding of epoxy resin and phase change material.

SEO M K, LEE E J, SONG J H, LEE K D, NAM C R, SONG J, LEE K

Manufacturing heat dissipation composite by melting and stirring epoxy resin, phase change material, and curing agent, curing at temperature higher than curing temperature of epoxy resin to form matrix, and simultaneously performing secondary main curing and high-density compression processing.

SEO M K, LEE E J, SONG J H, LEE K D, NAM C R, SONG J, LEE K