国家/地区 中国（3）
IPC部 B（3）
IPC大类 C08（3）
IPC小类 C08K（3）
IPC C08K003/04（3）
发明人
公开年
申请年 2009（2） 
专利权人

Composition for use in manufacture of in-mold electronic component, e.g. light emitting diode, comprises resin composition, and plastic composition.

CHAKI N K, SHAH C P, SINGH B, RAUT R, KAUSHIK V S, PANDHER R, NAGARAJAN N, KUMAR S M, RUSTOGI A, M S K, KAUSIK B, PANDER R, NAGARAZAN N, RUSTOGGI A

Resin composition for treating surface of steel sheet, comprises binder resin, graphene and solvent.

CHO J D, LEE J R, LEE J S, SHIM S E, LEE J, CHO J, SHIM S

Conductive material e.g. transparent conductive electrode for touchscreen or LCD display, comprises assemblage of graphene sheets interconnecting electrically in discrete transparent layer, which has area of greater than specified value.

HAMILTON J, STREICH P, HAEMILTEON J, SEUTEURECHI P, STREICH P V, HAMILTON J P