国家/地区 世界知识产权组织（2）
IPC部 C（2）
IPC大类 C08（2）
IPC小类 C08J（2）
IPC C08L079/08（2）
发明人
公开年
申请年 2020（2）
专利权人

Condensation curable composition for use in cured silicone-imide material for article in aerospace device, electronic device, electronic component, automobile, insulation, coating, or solvent resistant membrane, comprises silicone-imide base polymer, crosslinker, and condensation cure catalyst.

KONWAR D B, FUJIMOTO T, MANDAL S

Electroplating of metal on surface of insulating base material for printed circuit board, involves mixing resin and solid filler to obtain resin coating, coating conductive substance forming film and placing in plating solution.

LAI Z, LIANG X, ZHAO T, LIU D, SUN R