国家/地区 中国（7） 世界知识产权组织（2）
IPC部 C（8）
IPC大类 C08（8）
IPC小类 C08J（8）
IPC C08L079/08（8）
发明人
公开年 2021（8）
申请年 2021（4）  2020（3） 
专利权人

Preparation of graphene waterproof antistatic coating used for substrates, by heating polyvinyl alcohol in deionized water, adding trifunctional aziridine and sodium carboxymethyl cellulose, heating, adding graphene slurry and stirring.

ZHAO F, SHI J, LI Q, YUE X, CHEN G

Transparent polyimide composite conductive film comprises silver nanowire layer and graphene oxide layer attached to transparent polyimide base film surface.

JIN W, XU Z, QUE X

Composite material useful for electronic device, preferably galvanic cell, supercapacitor, or fuel cell, comprises polyamide-imide, and nanoplatelets.

HODGE S A, GALHENA D T L, GALHENA D T L G

Bendable electro-thermal film device comprises polyimide base layer coated with organic electric heating film on surface and organic electro-thermal film comprises e.g. graphene, multi-wall carbon nano-tube and carbon black granules.

CHEN D, YANG Y

Aqueous anti-corrosion non-stick coating comprises fluorine resin emulsion, polyamide-imide (PAI) emulsion, anti-corrosion filler, pigment, auxiliary agent, pH regulator and water.

LIU H, QIAN T

Electroplating of metal on surface of insulating base material for printed circuit board, involves mixing resin and solid filler to obtain resin coating, coating conductive substance forming film and placing in plating solution.

LAI Z, LIANG X, ZHAO T, LIU D, SUN R

Elastic hot-melt conductive paint to prepare elastic hot-melt conductive film, comprises elastic hot melt resin, film-forming agent, leveling agent, dispersant, conductive material and other additives, and has preset viscosity.

ZHAO M, CHEN Y

Electronic skin comprises e.g. encapsulation layer arranged on sensing layer, glue layer arranged on bottom of base layer and release paper arranged on glue layer, base layer and packaging layer are provided with heat dissipation layer.

JIANG Z, LI W