国家/地区 中国（2）
IPC部 B（2）
IPC大类 C01（2）
IPC小类 C01B（2）
IPC C09D201/00（2）
发明人
公开年
申请年
专利权人

Flexible, low shrinkage, conductive formulation for coating substrate of articles and filling gaps in electronic packages comprises sinterable, conductive metal particles, graphene, diluent, and polymer resin.

HONG X, SANCHEZ J G, CAO X, ZHUO Q

Graphene composite coating layer for coating target object surface comprises curable mixed resin consisting of curable resin and curing agent and surface-modified nano graphene sheets which are evenly spread in curable mixed resin.

WU M Y, HSIEH C, SHUI C, WU Y, XIE C, HSIEH C Y, SHUI C K