国家/地区 中国（4）
IPC部 C（4） B（2）
IPC大类 C08（4）
IPC小类 C08K（4） C08L（4） C09K（4）
B29D（2） C08J（2）
IPC C08K003/04（4）
发明人 LIU F（4）
公开年 2019（2）
申请年 2019（2） 
专利权人 JIANGSU JIAN.（2）

Heat-conducting gel used for heat dissipation of electronic device, comprises silicone oil matrix, bisphenol-A-type epoxy resin and heat-conducting filler comprising modified graphene, modified diamond and modified carbon nanotubes, where surface of modified graphene is modified with amino group.

HE Y, LIU F, YU G

Polymer composite material comprises micro-nano hybrid structure filler, where the composite material comprises graphene nanosheets, magnesium salt whiskers and polymer matrix, where magnesium salt whiskers are magnesium hydroxide whiskers.

XU H, XU W, LIU F, LIU T, LIU Y, LI J

Heat-conducting polymer film comprises polymer matrix, uniformly dispersed and highly oriented graphene, second heat conducting filler, surface processing agent, filling agent and processing auxiliary agent.

XU H, XU W, ZHU Y, DI L, LIU F, LIU T, LIU Y, QU B, MA Q, LI J

Polymer thermal conductive film comprises polymer matrix, graphene, second heat-conducting filler, surface treating agent, filler coating agent and processing aid.

XU H, XU W, ZHU Y, DI L, LIU F, LIU T, LIU G, QU B, MA Q, LI J