国家/地区 中国（2） 美国（2）
IPC部 B（4）
IPC大类 B29（4）
IPC小类 B29C（4）
IPC B82Y030/00（4）
发明人
公开年 2021（2）
申请年 2021（4）
专利权人

Epoxy molding compound used in fluid ejection device for encapsulating fluidic dies, comprises hardener, inorganic based filler, catalyst to accelerate curing of epoxy molding compound, and conductive additive.

SONG B, ZHANG Z

Matter composition comprises epoxy functionalized two-dimensional shaped particles comprising functionalized graphene, clays, and alumina platelets, carbon nanotubes, epoxy resin, and curing agent comprising ionic liquid, and 1-ethyl-3-methylimidazolium dicyanamide.

KALB J, IFTIME G, WEI J, PANDEY R, RAHULPANDY, JUNHUA W, JAMIKALB

Producing polyethylene/graphene composite for electronics applications, by forming mixture of graphene nanoplatelets and low density polyethylene powder, forming composite powder by ball milling, press molding, placing source electrode into composite plate, and applying alternating current voltage.

ZAZOUM B

High heat dissipation solar photovoltaic backplane includes outer layer including polyolefin and inner layer including polyolefin, boron nitride nanosheets, and modified graphene oxide.

JIAO H, CAI S