国家/地区 日本（2）
IPC部 B（2）
IPC大类 B32（2）
IPC小类 B32B（2）
IPC B32B005/18（2）
发明人 NAKAMURA K（2） SAWA K（2）
公开年 2017（2）
申请年 2015（2）
专利权人 SEKISUI CHEM.（2）

Resin laminate used for e.g. construction material, consists of foamed resin layer having preset expansion ratio and reinforced resin layer comprising carbon material containing synthetic resin and graphene laminated structure.

NAKAMURA K, SAWA K

Heat conductive sheet for electronic device casing, has layers comprising synthetic resin and carbon material of graphene laminated structure, and heat conductivities measured at different direction satisfying preset relation.

NAKAMURA K, SAWA K, KUSACHI K