国家/地区 中国（6） 日本（2） 美国（2）
IPC部 C（6）
IPC大类 C08（6）
IPC小类 C09D（6）
IPC C09D007/61（3） B32B027/30（2） B65D065/40（2）
C08J005/18（2） C08K003/04（2） C09D007/40（2）
发明人 CHEN C（6）
公开年 2023（3）
申请年 2022（2） 
专利权人

Producing food packaging barrier film used for consumers to clearly see content of packaged goods, involves providing base film, depositing inorganic laminated film on surface of base film, where inorganic laminated film includes at least one first and second inorganic material deposition layer.

CHEN C, TSAO C, LIAO T, LIAO T C, TSAO C C, CHEN C H, CHEN Z, CAO J, LIAO D

Silicone foam sheet comprises silicone resin composition modified chitosan sol solution, where silicone resin composition includes carbohydroxy modified organopolysiloxane, epoxy resin, polylactic acid, alkyl phenol polyoxyethylene ether, sodium bicarbonate, water and zinc stearate.

CHEN C, LIN J

High ductility and high temperature resistant composite food packaging film useful for food packaging or food preserving, comprises modified composite film layer which is base modified film layer, maleic anhydride graft polyethylene resin film middle layer and polyethylene outer film layer.

CHEN C

Preparing aminated graphene oxide/sulfonated polyaniline modified waterborne epoxy resin anticorrosive coating for industry, involves preparing aminated graphene oxide/sulfonated polyaniline and graphene oxide dispersion followed by mixing.

LIU J, ZHANG J, WU M, WU Q, CHEN C, CAO Z, YU Q, CHEN H, YANG J

Aqueous organic epoxy zinc-rich coating comprises component comprising aqueous epoxy graphene zinc powder paint containing zinc powder and graphene, and component comprising aqueous epoxy component containing aqueous epoxy curing agent.

DING C, CAO Z, CHEN Z, CHEN C

Printed electronic device such as integrated circuit and printed circuit board comprises substrate and layer of electrically conductive ink comprising functionalized graphene sheets and binder applied to the substrate.

AKSAY I A, CHEN C, CHIANG K S, KORKUT S, LETTOW J S, PRUDHOMME R K, CRAIN J M, AKSAY I, CHIANG K, LETTOW J, PRUDHOMME R, PRUD HOMME R K, KORKUT S A, PRUD H R K, AKSAY L A