国家/地区 中国（2）
IPC部 C（3）
IPC大类 C08（3）
IPC小类 C08J（2）
IPC
发明人 ZHANG Z（3）
公开年 2023（3）
申请年 2021（3）
专利权人

Epoxy molding compound used in fluid ejection device for encapsulating fluidic dies, comprises hardener, inorganic based filler, catalyst to accelerate curing of epoxy molding compound, and conductive additive.

SONG B, ZHANG Z

Degradable copolyester composition used as antistatic biodegradable film material for preparing electronic packaging bag film, comprises degradable copolyester, antistatic agent including edge-modified graphene, where degradable copolyester is aliphatic aromatic copolyester.

ZHANG Z, ZHANG L, WANG X, GAO D, ZHANG T, ZHENG C, SONG Z, XU Y, ZHU G, LV M, GUO P

Sensor for converting measured physical quantity or mechanical quantity into electric quantity change, has first and second functional layers provided with same polymer, where cross-linked structure formed by polymer is bonded.

ZHANG Z, DAI Y, ZHANG Y, GUO C