国家/地区 韩国（4）
IPC部 C（4）
IPC大类 C08（4）
IPC小类 C08K（4） C08L（3） C09K（3）
C08J（2）
IPC C08K003/04（4） C09K005/08（3） C08K003/38（2）
C08K005/09（2） C08K009/12（2） C08L063/00（2）
发明人 LEE K（4）
公开年 2023（4）
申请年 2022（3） 
专利权人 HANSOL CHEM .（2）

Polyimide film used in multilayer film and flexible metal clad laminate, is obtained by imidizing polyamic acid solution containing dianhydride component including e.g. biphenyltetracarboxylic dianhydride, and diamine component including e.g. m-tolidine, and comprises graphene nanoplatelets.

JEON J, YEO M, BACK S, LEE K, CHUN J, BAEK S, LEE K N

Polydimethylsiloxane composite for heat dissipation/flame retardancy in field of automobiles and electrical/electronic comprises metal hydroxide-coated carbon body as filler based on polydimethylsiloxane.

SHIM S E, HWANG S, SO J, LEE K

Heat dissipation composite composition used for forming heat dissipation composite, comprises epoxy resin, and phase change material, and includes polymer matrix formed by chemical bonding of epoxy resin and phase change material.

SEO M K, LEE E J, SONG J H, LEE K D, NAM C R, SONG J, LEE K

Manufacturing heat dissipation composite by melting and stirring epoxy resin, phase change material, and curing agent, curing at temperature higher than curing temperature of epoxy resin to form matrix, and simultaneously performing secondary main curing and high-density compression processing.

SEO M K, LEE E J, SONG J H, LEE K D, NAM C R, SONG J, LEE K