国家/地区 中国（3）
IPC部 C（3）
IPC大类 C08（3）
IPC小类 C08K（3）
IPC C08K003/04（3） F21Y115/10（3） F21V029/85（2）
发明人
公开年 2018（3）
申请年 2017（2） 
专利权人

Heat dissipating interface material for high-power outdoor lighting light-emitting diode lamps, is prepared by reacting modified graphene, polydimethylsiloxane, paraformaldehyde and bisphenol A.

LI P, YANG C, YANG J, LIU T, YAO C, ZHAO D

LED lamp convenient heat-dissipating graphene material includes silicon carbide, graphene oxide, aluminum nitride, boron nitride, itaconic acid dimethyl ester, silicone resin, indium tin oxide, silicon nitride and magnesium sulfate.

WANG J, XU F

Heat dissipation device has base, and heat dissipation elements arranged on base, where heat dissipation channel is arranged between heat dissipation elements and base and dissipation elements are made of graphene composite material.

JIANG G, LU K