国家/地区
IPC部 B（3）
IPC大类 B82（3）
IPC小类 B82Y（3）
IPC B82Y030/00（2）
发明人
公开年 2023（3）
申请年 2021（3）
专利权人

Epoxy molding compound used in fluid ejection device for encapsulating fluidic dies, comprises hardener, inorganic based filler, catalyst to accelerate curing of epoxy molding compound, and conductive additive.

SONG B, ZHANG Z

Adding graphene derivatives in active layer and substrate layer in filtration membrane, involves adding predetermined quantity of graphene derivatives to predetermined quantity of organic solvent, and mixing graphene derivatives with organic solvent in predetermined ratio to form graphene dispersion.

KAUSHIK A

Stripping method of two-dimensional material, comprises uniformly mixing two-dimensional material with thermoplastic plastic to obtain mixture, heating and melting the mixture, where stripping system material is obtained by plastic processing technique.

WAN W, LI P, LIU S, LI W, ZHAO Z