国家/地区 中国（3）
IPC部 C（3）
IPC大类 C08（3）
IPC小类 C08G（3）
IPC C08K003/04（3）
发明人 ZHANG Z（3）
公开年
申请年
专利权人 UNIV SHANDON.（2）

Plug hole resin with low temperature resistance and high thermal conductivity used in circuit board production technology, e.g. deep sea, deep space and polar detection field comprises epoxy resin, reactive diluent, latent curing agent, imidazole curing accelerator, antifoaming agent, and filler.

LI Q, YANG X, JIANG M, ZHANG Z, HE Z, HU B, DENG W, CHEN L

Preparing polymer conductive composite hydrogel involves adding pyrrole monomer in graphene oxide aqueous solution, stirring and dispersing by ultrasonic wave to form solution, adding ferrous salt and hydrogen peroxide solution.

HAN Y, LI T, LI W, WANG T, GAO X, ZHANG Z, SONG H, ZHANG C

Preparation of highly elastic ternary composite hydrogel, involves dissolving acrylamide, initiator, dopant modifier, and crosslinking agent in graphene oxide dispersion, stirring, and ultrasonically dispersing to obtain solution.

HAN Y, WANG X, DENG Y, FANG T, ZHANG W, WANG T, GAO X, ZHANG Z