国家/地区 韩国（3）
IPC部 C（3）
IPC大类 C08（3）
IPC小类 C08G（3）
IPC C08K003/04（3）
发明人
公开年
申请年 2021（2） 
专利权人

Heat dissipation adhesive sheet useful in electronic components e.g. semiconductors, or PC boards comprise metal thin film layer formed on lower surface of heat dissipation layer, and adhesive layer on metal thin film layer.

HUN L S, SONG J, KWON H J, CHOI S, YUMINSOOK, YOUK S K

Bio-electrode composition used in contact with skin of living body for detecting physical conditions such as heart rate, comprises (A) reaction composite comprising ionic polymer material and carbon particle.

HATAKEYAMA J, SHANRUN

Flexible, low shrinkage, conductive formulation for coating substrate of articles and filling gaps in electronic packages comprises sinterable, conductive metal particles, graphene, diluent, and polymer resin.

HONG X, SANCHEZ J G, CAO X, ZHUO Q