国家/地区 中国（4）
IPC部 C（5）
IPC大类 C08（5）
IPC小类 C08G（5）
IPC C08K003/38（5）
发明人
公开年 2021（4）
申请年 2021（5）
专利权人

Polyimide composition comprises polyimide, where polyimide is polymeric reaction product of dianhydride and one or more diamines, where diamines comprises fluorine-containing alkyl ether diamine, and thermally conductive fillers.

CONNELL J W, BELCHER M A, GHOSE S

Bio-based nano-synergistic flame retardant used in polymer composite material e.g. epoxy resin composite material, comprises two-dimensional material, transition metal organic framework intercalated in material, and phytic acid wrapped outside organic framework.

GONG K, ZHOU K, YIN L

Preparing furan resin comprises e.g. adding solid formaldehyde and urea into reaction kettle, adding boric acid, carrying out catalytic reaction of prepared graphene dispersant and furanone, carrying out, adjusting pH, reacting with modified lignin and stirring with coupling agent and metal salt.

ZHENG J, HOU X, LUO X, SUN D, LIU M, PAN Y, SUN Z

Preparing heat dissipation film based on large-diameter graphene oxide comprises e.g. stirring modified graphene oxide, modified boron nitride, modified carbon nanotube and solvent into reactor, reacting and casting polycondensate into film.

CUI J, XU P, LI Y, ZHANG B

High heat-conducting four-needle-shaped composite particle/polyimide film useful in electronic materials e.g. thermal management materials and interface materials, comprises heat-conducting filler, surfactant and polyamic acid solution.

MA C, CHI H, LIU D, ZHANG P, DAI P