国家/地区 中国（3）
IPC部 C（3）
IPC大类 C08（3）
IPC小类 C08G（3）
IPC C08K003/04（3）
发明人
公开年 2017（3）
申请年 2016（3） 
专利权人

High thermal conductivity type epoxy resin composite material for LED bonding layer, contains bisphenol A type epoxy resin, boron carbide powder, aluminum oxide, glue 107, dibutyltin dilaurate, ethyl orthosilicate, graphene oxide.

LI H, LIU Y, CHEN Y

Graphene-boron nitride composite material useful as filler for preparation of thermally conductive film, has graphene sheets, boron nitride sheet and polydopamine linked between graphene sheets and boron nitride sheet as bridge molecule.

ZHU P, GAO Y, SUN R

Sheathing material used for crosslinked steering wheel protective layer includes fulvic acid, dodecyl dimethyl betaine, graphene oxide, hydrazine hydrate, octamethylcyclotetrasiloxane, sulfuric acid, toluene diisocyanate, and butyl acetate.

ZHOU D, XUAN H, WANG L, LIU S