国家/地区 韩国（2）
IPC部 C（2）
IPC大类 C08（2）
IPC小类 C08G（2）
IPC C08K003/22（2）
发明人
公开年
申请年
专利权人

Maleimide resin film used in maleimide resin composition and as adhesive resin film having low dielectric property, comprises maleimide, (meth)acrylate, inorganic particles with respect to whole resin film and curing catalyst.

IGUCHI H, TSUTSUMI Y, KASHIWAGI T, DI J

Composition used for improving neutron shielding performance, comprises epoxy resin, amine curing agent, surface treated aluminum hydroxide and zinc borate, surface-treated boron carbide, and borated graphene and density increasing agent.

SHIN S