国家/地区 美国（4）
IPC部 C（4）
IPC大类 C08（4）
IPC小类 C08G（4）
IPC C08K003/38（4）
发明人 IGUCHI H（2） KASHIWAGI T（2） TSUTSUMI Y（2）
公开年 2021（2） 2022（2）
申请年 2020（2） 
专利权人 SHINETSU CHE.（2）

Producing maleimide resin film used in flexible printed-wiring boards, involves applying maleimide composition in fluid form to form shape of film, and volatilizing organic solvent from the maleimide composition to obtain the maleimide resin film which is solid and uncured resin film.

KASHIWAGI T, TSUTSUMI Y, IGUCHI H

Polyimide composition comprises polyimide, where polyimide is polymeric reaction product of dianhydride and one or more diamines, where diamines comprises fluorine-containing alkyl ether diamine, and thermally conductive fillers.

CONNELL J W, BELCHER M A, GHOSE S

Polymeric material for two-portion composition, comprises a polymerized reaction product of a polymerizable composition comprising components, where components comprises a uretdione-containing material.

WHITE K L, YAO L, RULE J D, KRYGER M J, KROPP M A

Maleimide resin film used in maleimide resin composition and as adhesive resin film having low dielectric property, comprises maleimide, (meth)acrylate, inorganic particles with respect to whole resin film and curing catalyst.

IGUCHI H, TSUTSUMI Y, KASHIWAGI T, DI J