国家/地区 中国（2）
IPC部 C（3）
IPC大类 C08（3）
IPC小类 C08G（3）
IPC C08J005/18（3）
发明人
公开年 2022（2）
申请年 2020（3）
专利权人

Condensation curable composition for use in cured silicone-imide material for article in aerospace device, electronic device, electronic component, automobile, insulation, coating, or solvent resistant membrane, comprises silicone-imide base polymer, crosslinker, and condensation cure catalyst.

KONWAR D B, FUJIMOTO T, MANDAL S

New low-dielectric polyimide useful in preparation of low-dielectric polyimide film for electronic packaging.

QIAN X, LIAO B, ZHANG B

High dielectric polyimide film comprises polyimide and graphene oxide uniformly filled in the polyimide.

XU J