国家/地区 中国（5）
IPC部 C（5） H（2）
IPC大类 C08（5）
IPC小类 C08G（5）
IPC C08L079/08（5）
发明人 ZHANG B（5）
公开年 2022（3）
申请年 2020（3） 
专利权人 ZHUZHOU TIME.（3）

Manufacture of high heat-resistant ultra-low expansion polyimide film for e.g. electronics, microelectronics , optical display or optical communication field, by mixing raw material with solvent, filtering, vacuum defoaming, uniformly coating, and peeling substrate.

QIAN X, LIAO B, ZHANG B

Preparing high temperature resistant polyimide useful for manufacturing flexible display substrate, comprises e.g. carrying out suction filtration and vacuum defoaming of polyamic acid resin solution, casting on casting plate, solidifying into adhesive film.

QIAN X, LIAO B, ZHANG B

New low-dielectric polyimide useful in preparation of low-dielectric polyimide film for electronic packaging.

QIAN X, LIAO B, ZHANG B

Preparing heat dissipation film based on large-diameter graphene oxide comprises e.g. stirring modified graphene oxide, modified boron nitride, modified carbon nanotube and solvent into reactor, reacting and casting polycondensate into film.

CUI J, XU P, LI Y, ZHANG B

Composite film comprises substrate film composed of graphene, high molecular polymer, curing agent and coating layer.

SUN R, YE H, ZHAO T, ZHANG B, HU Y, LIANG X