国家/地区 中国（4）
IPC部 C（5）
IPC大类 C08（5）
IPC小类 C08G（5）
IPC C09K005/14（5）
发明人
公开年 2022（3） 2023（2）
申请年 2022（5）
专利权人

Preparing graphene/zirconium-BDC-metal-organic framework/perovskite quantum dot high thermal conductivity composite material comprises e.g. dispersing quantum dots in toluene, taking zirconium oxychloride octahydrate, washing, placing sodium nitrate into beaker, adding sulfuric acid and compounding.

WANG S, LUAN Y

Preparation of oriented heat conducting sheet used in semiconductor heat dissipating device, involves placing fluid composition in orientation molding device having sleeve barrel, applying circumferential shear force, heat-curing formed multilayer aggregate, and slicing oriented composition block.

REN Z, WANG H, GU Z

Addition-type organic silicon heat-conducting adhesive masterbatch comprises organic silicon monomer I, organic silicon monomer II, blocking agent, catalyst I and high heat-conducting filler.

HAN Y

Preparing thermally conductive filler for highly thermally conductive elastomer comprises e.g. adding composite thermally conductive material and grafted graphene oxide to mixed solvent of ethanol and water, ultrasonically dispersing, grinding, transferring to reaction vessel, and precipitating.

LIU Y, ZHONG R, LI T

Flexible heat dissipation material comprises polymer masterbatch modified by hydroxylated boron nitride nanosheets; functionalized graphene; and polymer.

LI X, HE Y, GUO H