国家/地区 中国（2） 世界知识产权组织（2）
IPC部 B（3）
IPC大类 C08（3）
IPC小类 C08G（3）
IPC
发明人 ZHANG Z（3）
公开年
申请年 2021（3）
专利权人

Epoxy molding compound used in fluid ejection device for encapsulating fluidic dies, comprises hardener, inorganic based filler, catalyst to accelerate curing of epoxy molding compound, and conductive additive.

SONG B, ZHANG Z

Method for grouting and plugging of cable conduits through-holes comprise e.g. cutting film according to shape and size of cable, tearing adhesive tape isolation paper, filling cavity with quick-setting flame-retardant foaming material component, and opening small hole on surface of film.

LI P, WEI H, ZHU J, WENG L, ZHANG Z

New nitrogen-15 and nitrogen-14 interspersed uniform nitrogen-doped graphene useful in preparing graphene materials and modified graphene materials.

HUANG M, LUO X, DENG H, JIA Q, PENG S, ZHANG Z, XI S, LIU Y, LIU X, CHI S