国家/地区 中国（3）
IPC部 B（4）
IPC大类 B82（4）
IPC小类 B82Y（4）
IPC B82Y030/00（4）
发明人 CHEN J（2）
公开年 2021（2）
申请年 2021（4）
专利权人

Epoxy molding compound used in fluid ejection device for encapsulating fluidic dies, comprises hardener, inorganic based filler, catalyst to accelerate curing of epoxy molding compound, and conductive additive.

SONG B, ZHANG Z

Matter composition comprises epoxy functionalized two-dimensional shaped particles comprising functionalized graphene, clays, and alumina platelets, carbon nanotubes, epoxy resin, and curing agent comprising ionic liquid, and 1-ethyl-3-methylimidazolium dicyanamide.

KALB J, IFTIME G, WEI J, PANDEY R, RAHULPANDY, JUNHUA W, JAMIKALB

Preparing manganese-metal organic frame/graphene oxide nano material useful for aqueous zinc ion batteries, comprises adding concentrated acid into graphene oxide-dimethyl sulfoxide powder sample, adding into four mixed solution to prepare mixed solution, heating, centrifuging, washing and drying.

PAN Y, YIN C, CHEN J, PAN C

Preparing dendritic composite nanowire three-dimensional electrode material useful for sewage treatment containing hexavalent chromium, comprises e.g. growing polypyrrole nanowires on three-dimensional anode, adding aniline to sulfuric acid, stirring, and reacting to obtain electrode material.

CHEN J, LIANG C, FAN C, QIU S