国家/地区 世界知识产权组织（2）
IPC部 B（2）
IPC大类 C01（2）
IPC小类 C01B（2）
IPC C01B032/182（2）
发明人
公开年
申请年 2017（2）
专利权人

Flexible, low shrinkage, conductive formulation for coating substrate of articles and filling gaps in electronic packages comprises sinterable, conductive metal particles, graphene, diluent, and polymer resin.

HONG X, SANCHEZ J G, CAO X, ZHUO Q

Forming composite used e.g. in device and as part of capacitor, comprises depositing monolayer of graphene on substrate, forming first polymer layer on monolayer by bringing monomer into contact with monolayer, and removing substrate.

RIIKONEN J, GRIGORYEVA M, SHAH A, LI C, LIPSANEN H