国家/地区 中国（2）
IPC部 B（3） C（3）
IPC大类 B82（3）
IPC小类 B82Y（3）
IPC B82Y030/00（3）
发明人
公开年 2023（3）
申请年
专利权人

Preparing thermally conductive filler/polyimide aerogel metallized high thermally conductive composite material, involves preparing thermally conductive filler/polyimide aerogel, electroplating aerogel material, and vacuum hot pressing.

CHEN C, ZHAO X, ZHOU H, ZHAO J, YANG L, WANG D

Epoxy molding compound used in fluid ejection device for encapsulating fluidic dies, comprises hardener, inorganic based filler, catalyst to accelerate curing of epoxy molding compound, and conductive additive.

SONG B, ZHANG Z

Preparing ultra thin bimetallic organic framework/carbon composite material useful as cathode active material of lithium ion battery of electrochemical energy storage device, comprises e.g. adding soluble salts of metal, iron (III), organic ligands and carbon dots into mixed solvent, and reacting.

XIAO X, HOU H, JI X, ZOU G