国家/地区 中国（9）
IPC部 C（9）
IPC大类 C08（9）
IPC小类 C08G（9）
IPC C08K003/04（9）
发明人 EMPARUZIA V（3） FARRUGIA V M（3） SIBANTIISWARISLISKA.（3）
SRISKANDAR S E（3） SRISKANDHA S E（3） CLARIDGE R（2）
INUI N（2） TAKAHASHI K（2）
公开年 2022（4）
申请年 2021（3）  2012（2） 
专利权人 XEROX CORP（3） SEKISUI CHEM.（2）

Composition used for three-dimensional printing e.g. additive manufacturing, comprises particles comprising thermoplastic polymer grafted to carbon nanomaterial, and particles have preset aerated density.

FARRUGIA V M, SRISKANDHA S E, CLARIDGE R, SRISKANDAR S E, EMPARUZIA V, SIBANTIISWARISLISKANDA

Method for selective laser sintering for three-dimensional article, involves depositing carbon nanomaterial-graft-polyamide particles with other thermoplastic polymer particles, and exposing to laser to fuse polymer particles and form consolidated component by selective laser sintering.

SRISKANDHA S E, FARRUGIA V M, EMPARUZIA V, SIBANTIISWARISLISKANDA, SRISKANDAR S E

Selective laser sintering process for preparing highly spherical particles, involves depositing carbon nanomaterial-graft-polyurethane particles on nanomaterial surface and exposing nanomaterial grafted polyurethane particles to laser, for fusing polymer particles and forming consolidated body.

SRISKANDHA S E, FARRUGIA V M, CLARIDGE R, EMPARUZIA V, SIBANTIISWARISLISKANDA, EASWARI S, SRISKANDAR S E

Polyamide molding composition used as a filled polyamide molding for producing moldings or components of automotive sector, comprises partially crystalline and aromatic polyamide, functionalized impact modifier, metallocene, and additive.

ALKAN A, CADALBERT A, BAYER A, HOFFMANN B, ALKANE A, DALBERT A, ALKA A

Electronic device e.g. printed circuit board, comprises singulated carrier portion, substrate molded onto singulated carrier portion, and conductive traces disposed on substrate, where substrate comprises polymer composition that includes aromatic polymer and electrically conductive filler.

KIM Y S, JIN R

Flexible, low shrinkage, conductive formulation for coating substrate of articles and filling gaps in electronic packages comprises sinterable, conductive metal particles, graphene, diluent, and polymer resin.

HONG X, SANCHEZ J G, CAO X, ZHUO Q

Method for forming high-strength graphene-reinforced polymer matrix composite for e.g. aircraft part for commercial application, involves applying succession of shear strain events to molten polymer phase.

NOSKER T, LYNCH J, KEAR B, HENDRIX J, CHIU G, ZHAO G, HENDRIKS J, NOSKER T J, LYNCHBRANZOI J K, KEAR B H

Manufacture of resin compound material involves uniformly dispersing carbon material having graphene structure in synthetic resin chosen from crystalline resin and non-crystalline resin under specified conditions.

SAWA K, TSUMURA K, INUI N, TAKAHASHI K, TANIGUCHI K

Resin composite material is obtained by chemically bonding reactive polyfunctional compound to both of thermoplastic resin, and carbon material having graphene structure.

MUKOHATA D, INUI N, TAKAHASHI K, OSANO K, MUKAIHATA D