国家/地区 中国（2）
IPC部 C（2）
IPC大类 C08（2）
IPC小类 C08J（2）
IPC C09D201/00（2）
发明人
公开年 2018（2）
申请年 2017（2）
专利权人

Flexible, low shrinkage, conductive formulation for coating substrate of articles and filling gaps in electronic packages comprises sinterable, conductive metal particles, graphene, diluent, and polymer resin.

HONG X, SANCHEZ J G, CAO X, ZHUO Q

Preparation of high dispersibility graphene master batch anti-corrosion coating by configuring hydrofluoric acid etchant, adding glass beads, stirring, etching, washing by clean water, micro ventilation drying and adding graphene powder.

CHEN Q, ZAN H