国家/地区 欧洲专利局（EPO）（2）
IPC部 B（2）
IPC大类 C01（2）
IPC小类 C01B（2）
IPC C09K003/00（2）
发明人
公开年
申请年
专利权人

Flexible, low shrinkage, conductive formulation for coating substrate of articles and filling gaps in electronic packages comprises sinterable, conductive metal particles, graphene, diluent, and polymer resin.

HONG X, SANCHEZ J G, CAO X, ZHUO Q

Solubilizing graphite, to prepare reduced graphene useful e.g. to prepare capacitor, comprises reducing graphite by metal to obtain graphite intercalation compound, and exposing the compound to solvent to give reduced graphene solution.

PENICAUD A, VALLES C, ALAIN P, CRISTINA V