国家/地区 中国（6）
IPC部 C（6）
IPC大类 C08（6）
IPC小类 C08K（6）
IPC C08K003/08（6）
发明人 AN D（2） GUO H（2） LAI C（2）
XIA J（2） XIAO J（2）
公开年 2017（4） 2016（2）
申请年 2016（6）
专利权人 TONGLING TON.（2）

Thermal conductive composite material for electronic equipment, contains silica gel, ethylene/butylene terephthalate copolymer, graphene, aluminum powder, polyethylene glycol, titanium dioxide, amylopectin, and antioxidant.

High thermal conductivity composite material comprises e.g. silicon carbide, aluminum powder, silicon dioxide, aluminum nitride, polyvinyl butyral, stearic acid, silver particles, dimethyl silicone oil, graphene and lithium hydroxide.

GUO H, AN D, XIA J, XIAO J, LAI C

Aluminum nitride-carbon nanowire composite material for LED, contains silicon carbide, aluminum powder, silicon oxide, yttrium oxide, montmorillonite, curing agent, emulsified silicone oil, stearic acid, polyvinyl butyral and graphene.

GUO H, AN D, XIA J, XIAO J, LAI C

Graphene-containing silicon rubber thermal-interface material used for LED, contains silicone rubber matrix, aluminum nitride, dopamine, silver nitrate solution, hydroxysilicone oil, vulcanizing agent, graphene and sodium dodecyl sulfate.

XIA Y

Metal alloy-doped graphene thin film material contains graphene, nickel alloy, magnesium alloy, aluminum alloy, polyimide, polysulfone, glass fiber, vinyl methyl ether, melamine phosphate, dispersant, coupling agent and thermal stabilizer.

ZHANG W

Friction material useful in heavy duty automotive brake pad, comprises e.g. phenolic resin, acrylic rubber, octylamine polyoctahedral silsesquioxanes, quartz fiber, aramid fiber, basic magnesium sulfate whisker and graphene oxide.

YANG G