国家/地区 中国（64） 世界知识产权组织（8） 台湾（4） 美国（4） 韩国（3） 澳大利亚（2） 日本（2）
IPC部 C（74） H（9） B（5）
G（3）
IPC大类 C08（74）
IPC小类 C09K（74）
IPC C08K003/04（46） C09K005/14（46） C08K003/22（19）
C08L083/04（17） C08K003/38（16） C08J005/18（14）
C08F220/56（9） C08K003/28（9） C08K003/08（8）
C08K007/24（8） C08K009/02（8） C08L063/00（8）
C09K005/06（8） C08K007/00（7） C08L083/07（7）
发明人 HE Y（6） HU J（5） LIU Y（5）
BAI Y（4） LI Z（4） TANG W（4）
WANG R（4） XIE G（4） CHEN J（3）
CHEN M（3） GE X（3） PAN Z（3）
TANG R（3） WANG X（3） YANG S（3）
公开年 2022（74）
申请年 2022（74）
专利权人 HANGZHOU FUX.（4） UNIV SOUTHWE.（4） ANHUI AEROSP.（3） UNIV SOUTH C.（3）
E INK CALIFO.（2） EINK CORP（2） ELEMENT CO L.（2） UNIV QINGDAO.（2）

Preparing thermal conductive composite film comprises graphitizing carbon nano-tube, processing carbon nano-tube into fatty acid, mixing with graphene, ball milling carbon nano tube-graphene, grinding, filtering, drying, rolling and forming.

LIU P

Preparing flexible phase-change composite material useful in field of waste heat utilization and thermal energy storage, comprises e.g. mixing nanocellulose, thermally conductive filler, acrylamide, ferric oxide and anti-freezing agent, high-speed shearing, and polymerizing acrylamide in emulsion.

WANG C, YE Z, CHEN J, HE Y, CHEN G

Preparation of composite heat-conducting pad involves cutting planar high-thermal conductivity film material into fibers, filling gaps between high-thermal conductivity fibers with organic matter, and slicing obtained composite block in direction perpendicular to high-thermal conductivity fibers.

HUANG K, QIN F, WEI T

Thermally conductive, electrically insulating film used in electronic products and devices, comprises thermoplastic resin, and thermally conductive filler comprising thermally conductive carbon-based filler, thermally conductive metal oxide or hydroxide filler and thermally conductive ceramic filler.

MENG F

Flexible heat-conducting pad comprises liquid metal, solid heat-conducting filler and polymer, and is prepared by pouring liquid metal int polymer, stirring under air environment, dispersing liquid metal uniformly in polymer, and adding solid heat conducting filler into polymer.

CAO B, ZHANG X

Folding, bending and stretching flexible high heat conducting film useful in chips, comprises graphene-based materials, acrylate group, film-forming auxiliary agent and heat-conducting filling material comprising graphene oxide, aluminum nitride or boron nitride or aluminum nitride and boron nitride.

ZHAO L, ZHANG L

Plugging type fluid loss agent for oil-based drilling fluid, comprises oxidized graphene, concavo-convex rod-shaped stone, initiator, silane coupling agent, cross-linking agent, matrix asphalt and aggregate monomer, aggregate monomer is synthesized by acrylamide and acrylic acid.

YUAN X, WU L, SHI H

Graphene-ceramic heat dissipation material with improved electrical insulation and resin miscibility comprises first dispersion solution is dispersed and second dispersion solution in which ceramic heat-dissipating filler is pulverized.

KYOUNGJEONGBAE, CHO J I, YANG H J, SONG H, SU Y C

Producing graphene-ceramic heat dissipation material with improved electrical insulation and resin miscibility, comprises preparing first dispersion solution by dispersing graphene interlayer material in aqueous solvent.

KYOUNGJEONGBAE, SU Y C

Preparing poly(vinylidene fluoride-co-trifluoroethylene) composite film with controllable fluorescent used in multifunctional sensors, comprises mixing poly(vinylidene fluoride-co-trifluoroethylene) powder and rare earth ion co-doped beta-sodium yttrium fluoride nanoparticles and spin-coating.

HAN G, LIU K, CHEN R, REN Z, SHI J, ZHOU D