国家/地区 中国（2） 美国（2）
IPC部 C（5）
IPC大类 C08（5）
IPC小类 C08K（5）
IPC C08K007/06（5）
发明人
公开年 2023（5）
申请年 2022（2）  2023（2） 
专利权人

Preparing chitosan modified boron nitride and graphene fiber composite material useful for thermal conductivity modification of epoxy resin, comprises e.g. dissolving chitosan in acetic acid solution, adding phytic acid solution containing choline chloride, adding boron nitride and centrifuging.

ZHANG Q, WANG S

Thermally conductive material comprises base polymer, ethylene methyl acetate, graphite fibers and bis(2-ethylhexyl) adipate.

PARE R, KAMAVARAM V

Carbon material dispersion liquid used for forming coating material, comprises carbon black, carbon fiber, graphite, graphene, water, and polymer dispersant comprising polymer block with structural units derived from acrylonitrile and methacrylic acid.

SHIMANAKA H, MURAKAMI K, DOI S, SHIMOOKA R, UMEDA D, KANEKO S, GOTO J

Preparing three dimensional thermally conductive skeleton/polyimide thermally conductive composite material comprises subjecting thermally-conducting porous material soaked by polyamic acid solution, performing freeze drying and phase conversion treatment to thermally-conducting porous material.

CHEN C, ZHAO X, ZHOU H, ZHAO J, YANG L, WANG D

Preparation of oriented heat conducting sheet used in semiconductor heat dissipating device, involves placing fluid composition in orientation molding device having sleeve barrel, applying circumferential shear force, heat-curing formed multilayer aggregate, and slicing oriented composition block.

REN Z, WANG H, GU Z