国家/地区 中国（3）
IPC部 C（3） H（3）
IPC大类 C08（3）
IPC小类 C08K（3）
IPC C08K003/04（3）
发明人
公开年 2016（3）
申请年 2016（3） 
专利权人

Back film for silicon solar panel, contains graphene, ammonium phosphate, sodium tetraborate, zinc oxide, silicon carbide, soybean lecithin, vegetable oil, titanium dioxide, glycerin, polymethyl methacrylate and t-butylstyrene.

FU X

Modified epoxy resin adhesive used in LED chip packaging comprises bisphenol A epoxy resin, m-phenylenediamine, oxidized graphene, nano zirconium oxide, carbon nanotube, silane coupling agent and aluminum isopropoxide.

QIN T

Light emitting diode heat abstractor material comprises methacrylic acid ester-acrylic ester copolymer, potassium hexatitanate whisker, multi-walled carbon nanotube and graphene.

CHEN H, CHEN X, HE C, WANG P, WANG X, ZOU D