首页
论文数据库
SCI论文数据库
中文期刊数据库
硕博士论文数据库
专利库
专家库
企业库
产品库
登录
搜索
国家/地区
中国(3)
IPC部
C(3)
IPC大类
C08(3)
IPC小类
C08L(3)
IPC
C08L079/08(3)
发明人
公开年
2021(3)
申请年
2020(2)
专利权人
Polyimide high thermal conductivity double-sided adhesive tape comprises e.g. multiple convex points arranged in array on thermally conductive polyimide layer and protrude toward upper and lower surfaces of polyimide layer.
LIN Z
Electronic skin comprises e.g. encapsulation layer arranged on sensing layer, glue layer arranged on bottom of base layer and release paper arranged on glue layer, base layer and packaging layer are provided with heat dissipation layer.
JIANG Z, LI W
Ultra-thin composite adhesive film comprises graphene heat dissipation layer, substrate layer, first metal layer and colloid layer stacked in sequence, second metal located between graphene heat dissipation layer and substrate layer.
LI L, LIANG C
上一页
当前第
1
页 共
3
条
下一页