国家/地区 世界知识产权组织（4）
IPC部 C（4）
IPC大类 C08（4）
IPC小类 C09D（4）
IPC C08K003/04（2）
发明人
公开年 2022（4）
申请年 2021（2） 
专利权人

Coated substrate used for electronic device, comprises substrate comprising a metal or metal alloy, basecoat layer on substrate, where basecoat layer comprises pigment particles and one-part thermally cured polymeric resin, and anti-fingerprint topcoat layer on basecoat layer.

WU K, LI Y, CHANG C H, ZHU X

Aqueous sealing layer for sealing microcells of electro-optic devices, comprises water soluble poly(vinylalcohol) homopolymer or poly(vinyl alcohol-co-ethylene) copolymer, and polyurethane.

SARVI A, BERHANE A, AZAGARSAMY M A, PARENT M E, AZAGARSAMY M

Condensation curable composition for use in cured silicone-imide material for article in aerospace device, electronic device, electronic component, automobile, insulation, coating, or solvent resistant membrane, comprises silicone-imide base polymer, crosslinker, and condensation cure catalyst.

KONWAR D B, FUJIMOTO T, MANDAL S

Carbogenic nanoparticle-conducting polymer composite ink for thin film coated printed circuit board, dispersed in water, where carbogenic nanoparticle is reduced graphene oxide, and composite ink includes e.g. graphene oxide-polypyrrole composite ink and carbon quantum dots-polyaniline composite ink.

BHATTACHARJEE L, SHARMA A, MANNA U, GOEL A, PAL B, BESSEMER C