国家/地区 中国（2）
IPC部 C（3）
IPC大类 C08（3）
IPC小类 C08K（3） C08L（2） C09D（2）
G02F（2） H05K（2）
IPC C08K003/04（3）
发明人
公开年 2021（2）
申请年 2019（3）
专利权人

Flexible heat-conducting insulating material used in electronic device, and preparing heat-dissipating plate and smart power module, comprises silicone oil, metal oxide and curing agent, where curing agent is hydrogen-contained silicone oil.

WANG X, FENG Y

Barrier film for quantum dot sheet comprises first layer including barrier layer positioned on base film, and second layer located on barrier layer, where barrier layer is dry coating layer or wet coating layer.

KIM H, KIM J H, LEE J, HWANG M

Photosensitive polyimide resin composition comprises photosensitive polyimide derivative, photoinitiator, free radical polymeric compound, solvent, alumina, graphene, inorganic clay, silicon oxide and zinc oxide.

HUANG T, ZHUANG C, SHI Y, XIE K, HUANG T C, CHUANG C C, SHIH Y C, HSIEH K H