国家/地区 中国（3） 美国（2） 世界知识产权组织（2）
IPC部 C（4）
IPC大类 C08（4）
IPC小类 C08K（4） C08L（3） C09D（3）
C09K（2）
IPC C08K007/06（4）
发明人
公开年 2021（4）
申请年 2019（2）  2020（2） 
专利权人

Infrared absorbing composition used in device, in layered structure as infrared emitter/absorber, to prepare surface to absorb infrared radiation and making coatings comprises layer of metal carbides and nitrides material.

HAN M, GOGOTSI Y

Thermoconductive photosensitive material comprises photosensitive polyimide which is (co)polymer, inorganic filler e.g. alumina and graphene, and having preset particle size, and silica solution, and has preset thermal conductivity.

CAO X, GUI C

Electronic skin comprises e.g. encapsulation layer arranged on sensing layer, glue layer arranged on bottom of base layer and release paper arranged on glue layer, base layer and packaging layer are provided with heat dissipation layer.

JIANG Z, LI W

Manufacture of substrate for device for shielding electromagnetic radiation, involves providing polymer material and/or precursor comprising conductive filler, and subjecting polymer material and/or precursor to shaping with material bond.

SCHROIFF V, SUTTER M, HAUER M, GRUNE E