国家/地区 中国（3）
IPC部 C（3）
IPC大类 C09（3）
IPC小类 C09J（3）
IPC C09J011/04（3）
发明人 HE J（3）
公开年 2022（3）
申请年 2022（2） 
专利权人

Preparing composite adhesive for manufacturing label, adhesive tape and protective glue for bonding electronic device, fixing, radiating fin to microprocessor and other electronic devices, involves subjecting graphite powder to liquid phase exfoliation in chloroform.

HE J, ZHANG W, YE H, ZHOU H, XU L

Graphene-based MS sealant construction technique used in building material, comprises e.g. cleaning, using foam strips to fill cracks at joint position, extruding MS sealant from nozzle, and using a scraper to perform initial pressing and smoothing along opposite direction of glue injection.

QIAN W, YUAN X, HE J, ZOU C, XU Z, ZHANG C, ZHOU H, WEI S, XU J, GAO H, QIAN F, LI Z, XU Y

Non-hydrogel flexible electronic packaging material used in embedding flexible electronic circuit device, comprises low volatility non-water filling medium, organic silicon copolymer, vinyl silicon oil, modified nano filler and crosslinking agent.

ZHOU R, ZENG J, LUO Y, YE S, CHEN Y, GONG J, HE J