国家/地区 韩国（4）
IPC部 C（4）
IPC大类 C08（4）
IPC小类 C09J（4） C08K（3） H01L（2）
H05K（2）
IPC C09J011/04（4）
发明人
公开年 2022（4）
申请年 2021（4） 
专利权人

Polyol-modified aspartic two-component polyurea-based composition useful as e.g. heat dissipation adhesive for electronic devices, comprises aspartic ester resin and polyol, polyisocyanate, and thermally conductive inorganic filler.

KIM H J, JANG J G, SEO K H

Adhesive film for producing structure e.g. heat-dissipating substrate, is formed of adhesive resin composition that contains thermally conductive filler composed of at least one of graphene having two-dimensional structure and single-walled boron nitride, thermosetting component and binder polymer.

ISAO I, TAKEO Y, ICHIKAWA I, YOSHINOBU T

Electroconductive composition used as interconnection material, contains resin component containing functionalized polybutadiene, electroconductive filler, curative, core-shell rubber toughener, epoxy reactive diluents and curing agent.

ESTRUGA ORTIGA M, HENCKENS A, ESTRUGA O M, ESTRUGAORTIGAMARQUE

Bonding two substrates for forming bonded assembly by pre-curing thermoset adhesive using radio-frequency energy, where adhesive comprises radio-frequency susceptor, and subjecting thermoset adhesive to heat treatment.

GREEN M, GREUNER J, VASHISTH A, AUVIL T, SOPHIEA D, MASTROIANNI S, GRUNER J, BASIS A, SOPHIA D