国家/地区 韩国（7）
IPC部 C（7） H（3） A（2）
B（2）
IPC大类 C08（7）
IPC小类 C08L（7）
IPC C08K003/04（5） C01B032/21（2） C08K003/22（2）
C08L083/04（2） C08L101/00（2） C09D007/61（2）
发明人
公开年 2023（7）
申请年 2021（7）
专利权人

Member used for self-cooling in bed for active magnetocaloric regenerator, comprises heat dissipation sheath, self-cooling material loaded inside heat dissipation sheath and spacer provided on surface of self-cooling tape.

CHAE J G, WOO K, KANG K H, LEE A, CHUNG K C, KIM J W, LEE A Y

Composition useful for preparing light-shielding film of smartphone camera module as spacer, washer and coating solution comprises carbon-based particles, thermosetting binder resins, dispersants, polymer beads and solvents.

PARK S C, YUN J H, KIM Y S, KIM Y, PIAO S

Polydimethylsiloxane composite for heat dissipation/flame retardancy in field of automobiles and electrical/electronic comprises metal hydroxide-coated carbon body as filler based on polydimethylsiloxane.

SHIM S E, HWANG S, SO J, LEE K

New fluorinated carbonotrithioic acid based binder compounds useful in conductive adhesive of anode sheet to produce secondary battery for battery module of battery pack used in electrical device.

ZHANG M, ZHAO Y, LIN J, LI X, JIN H, YANJI J, JIANGHUI L, ZHU J H

Environmentally friendly clothing cover comprises cover body forming storage space for storing clothes, hook protruding part of hanger protrudes to outside, and located at upper center of cover body, and clothing entrance.

CHOI W S, KIM Y H, LEEJUNGEUN, KIM T H, LEE D H, JUNGMUG K, LIM J H, HO C I, KIM Y K, KIM J M

Heat dissipation adhesive sheet useful in electronic components e.g. semiconductors, or PC boards comprise metal thin film layer formed on lower surface of heat dissipation layer, and adhesive layer on metal thin film layer.

HUN L S, SONG J, KWON H J, CHOI S, YUMINSOOK, YOUK S K

Manufacturing coated glove having conductive coating layer comprises e.g. preparing conductive coating solution by mixing polymer, conductive material, crosslinking agent, and diluent, and coating conductive coating liquid.

YUN C H, PARK C, SU J, CHOI Y I, WOOK L