国家/地区 中国（2）
IPC部 B（2）
IPC大类 C23（2）
IPC小类 C23C（2）
IPC
发明人 LIU B（2）
公开年 2023（2）
申请年 2022（2）
专利权人

Preparation of additive used for preparing copper or copper alloy profile, involves coating graphene on raw material of copper or copper alloy powder surface, and performing high-energy beam additive manufacturing using obtained graphene modified copper or copper alloy powder.

LIU B, HOU H, LI T

Preparing graphene-doped copper bonding wire comprises taking graphene oxide, mixing with mixed metal powder to obtain molten mixed powder, placing semi-finished product wire into aqueous solution of reducing agent for heating, annealing, washing and drying.

FENG Z, QU S, LIU B, WANG T, LIN L