国家/地区 美国（2）
IPC部 B（3）
IPC大类 B23（3）
IPC小类 B23K（3）
IPC
发明人
公开年 2023（3）
申请年 2022（3）
专利权人

Metal particles used in adhesive paste or solder paste for composite bonding structure for semiconductor device, comprises core including metal and shell on surface of core, where shell comprises metal and nanoparticles.

CHU K, LEE J, JUNGHOON L, CHU K M

Manufacturing additive layer used for making particulate and particulate feedstock, involves receiving particulate at chemical vapor deposition reactor, flowing hydrocarbon gas into CVD reactor, decomposing hydrocarbon gas in CVD reactor, depositing carbonaceous coating on particulate.

SCHMIDT W R, ELWARDANY T I, SHE Y, SHARON J A

Machining of titanium alloy with micro-groove textured cutting tool has different type of tool inserts like plain tool, triangle micro texture tool and triangle texture tool with solid lubricant using tungsten carbide chemical vapor deposition coated insert.

KAUR H, BALA A, SETHI G, CHAWLA K, BAHL A, SINGH J, PRADHAN S, SOPPA I