国家/地区 中国（2）
IPC部 B（2）
IPC大类 B21（2）
IPC小类 B21B（2）
IPC
发明人
公开年
申请年 2022（2） 
专利权人

Processing and forming liquid cooling plate involves using high heat-conducting coefficient of aluminum alloy profile, sequentially acid eluting grease, coating anti-composite material graphene heat treatment, rolling composite, and blowing.

SHI C, YANG R, ZAN Y, SHI X, RUAN R, YOU H, ZHUO N, WU Y

Preparing copper alloy semiconductor lead frame for circuit board, comprises heating copper alloy ingots, removing oxide, aging, adding copper alloy semi-finished product silver plating bath for silver-plated plating treatment, and activating.

CAO G, LI C, XU J, YIN H