国家/地区 中国（2） 韩国（2） 世界知识产权组织（2）
IPC部 B（4）
IPC大类 B32（4）
IPC小类 B32B（4）
IPC C23C016/26（4）
发明人
公开年 2021（4）
申请年 2021（3） 
专利权人

Composite copper foil structure used for copper-clad laminate and printed circuit board, has shell layer comprising N-layer graphene layer and M-layer metal copper layer alternately laminated with each other, and where surface of shell layer close to copper foil core layer is graphene layer.

GAO F, CAI L, ZHANG Q

Carrier substrate for transferring transfer layer from carrier substrate to product substrate, comprises carrier base substrate, protective layer, and transfer layer grown on protective layer.

BURGGRAF J, JUERGEN B

Transferring graphene involves forming graphene on first substrate, forming polymer precursor mixture on second substrate, providing graphene oppositely to second substrate having polymer precursor mixture.

GU T J, JANG W, SEO Y, WHANG D, WHANG D M, SEO Y M, JANG W S

Preparing flexible temperature sensor based on graphene nanowall for e.g. optoelectronic devices, by preparing graphene nanowall on metal or substrates, transferring graphene nanowall with polymer, and connecting ends of nanowall and silver.

PENG X, WANG S, ZHENG Q