国家/地区 中国（5）
IPC部 C（5）
IPC大类 C09（5）
IPC小类 C09K（5）
IPC C09K005/14（4） B22F001/02（2） C23C016/26（2）
C23C016/455（2）
发明人
公开年 2020（4）
申请年 2020（5）
专利权人

Producing electronic component e.g., resistive memory element by providing substrate which is disposed in deposition chamber, and forming anchoring layer on surface by exposing the substrate to reactants in atomic layer deposition process.

KIRSCH P, RESCH S, SEIM H, WOODRUFF J, NANAYAKKARA C, RAISSI S

Preparing polypyrrole nanowire interface modified three-dimensional graphene/polydimethylsiloxane composite photothermal material comprises e.g. cleaning nickel foam, ultrasonicting, washing with deionized water, and drying with nitrogen.

ZHANG B, QIU Y

Preparing nickel-coated graphene silicon carbide involves using intermediate frequency furnace to melt metal nickel, and using breeze to blow the nano-graphene into vacuum tube, pouring the molten nickel water into the high-speed tuyere.

DAI Y

Graphene-coated substrate material comprises metal oxides, metal nitrides and/or non-metallic carbon materials, and graphene coated on surface of substrate.

RUAN S, HUANG J, DUAN S, LI S, SUN X, YU T, LIANG X

Graphene-coated aluminum/aluminum-based heat dissipation material comprises evaporated aluminum graphene and pure aluminum.

TANG G, LI D, HU Z, XU W, AN S, YANG X, LIU T, YI W, XU H, QU B, LI J