国家/地区 中国（2）
IPC部 B（2）
IPC大类 C22（2）
IPC小类 C22C（2）
IPC C22C001/10（2）
发明人
公开年
申请年 2022（2）
专利权人

Preparing graphene-doped copper bonding wire comprises taking graphene oxide, mixing with mixed metal powder to obtain molten mixed powder, placing semi-finished product wire into aqueous solution of reducing agent for heating, annealing, washing and drying.

FENG Z, QU S, LIU B, WANG T, LIN L

Liquid cooling plate based on coating graphene, has upper substrate and lower substrate that are connected together by rolling and flow channel is formed by blow molding.

SHI C, YANG R, ZAN Y, SHI X, RUAN R, YOU H, ZHUO N, WU Y