国家/地区 中国（3）
IPC部 D（3）
IPC大类 D04（3）
IPC小类 D04H（3）
IPC D04H001/728（3）
发明人
公开年 2023（3）
申请年 2023（3）
专利权人 UNIV BEIJING.（2）

Preparing polymer-based heat conductive complex material with a sandwich structure comprises alternately arranging a heat-conducting filler layer and a polymer layer, and hot-pressing.

ZHOU J, LIU Y

Photothermal material useful in seawater desalination, comprises polyacrylonitrile-cobalt-manganese layered double hydroxide film with a hierarchical structure.

ZHAO W, CHEN W, ZHENG R, SONG Y

High thermal conductivity composite film having needle-punched opening structure useful in the continuous production of thermally conductive composite film materials.

DAI P, LU S, ZHANG P, HUANG M, SONG M, LI X, MA C