国家/地区 美国（6）
IPC部 F（6）
IPC大类 F28（6）
IPC小类 F28F（6） H05K（5） C09K（2）
F28D（2）
IPC F28F021/02（5） C09K005/14（2） F28D021/00（2）
H05K001/02（2） H05K009/00（2）
发明人 KOSTELEC A D（2） PENG H（2） SILVERMAN E M（2）
STARKOVICH J A（2） TICE J B（2） ZENG X（2）
公开年 2018（5）
申请年 2017（6）
专利权人 NORTHROP GRU.（2）

Method for manufacturing graphene chip or powder, involves using electrostatic spray gun to conduct electrostatic spraying operation on material mixture of high molecule powder material, carbon black and graphene.

HUNG W, YEH Y, HU C, LEE K, LAI J

Computing device comprises a set of components that includes a conductive sheet, which is provided with first graphene layer to dissipate a portion of heat, and second graphene layer that is used as an electrical ground.

MORRISON J T, FILES J W, NORTH T C

Method for manufacturing heat spreader for printed wiring board, involves depositing layer of metal on layer of molybdenum and joining first and second graphene sheets to each other by alloy bonding first and second metal layers.

STARKOVICH J A, TICE J B, ZENG X, KOSTELEC A D, PENG H, SILVERMAN E M

Preparation of graphene thermally conductive film involves coating slurry prepared by dissolving graphene oxide powder in solvent, and defoaming resultant, on substrate, drying, winding, trimming, heating, cooling, and vacuum rolling.

ZHOU B, ZHOU R, LI F, LU J

Thermally conductive composite material used in electronic device e.g. CPU, comprises unitary graphene matrix material which is single crystal or polycrystalline, and contains chemically bonded graphene molecules or merged graphene planes.

ZHAMU A, XIONG W, JANG B Z, LIN Y

Printed wiring board, has thermal code material that is inserted between lower and supper surfaces of wiring boards, and includes planar graphene sheets thermo-mechanically bonded by metal alloy layer formed from planar layers.

STARKOVICH J A, TICE J B, ZENG X, KOSTELEC A D, PENG H, SILVERMAN E M