国家/地区 世界知识产权组织（5）
IPC部 B（5）
IPC大类 G06（5）
IPC小类 C01B（3） G06F（3） B22F（2）
B32B（2） C09D（2） G01N（2）
H01B（2）
IPC B22F009/04（2） C09D005/00（2） C09D175/04（2）
H01B013/00（2）
发明人 WU K（2）
公开年 2022（4）
申请年 2021（5）
专利权人 HEWLETTPACKA.（2）

Coated substrate used for electronic device, comprises substrate comprising a metal or metal alloy, basecoat layer on substrate, where basecoat layer comprises pigment particles and one-part thermally cured polymeric resin, and anti-fingerprint topcoat layer on basecoat layer.

WU K, LI Y, CHANG C H, ZHU X

Laminate used for electronic device such as display device, comprises substrate, layer containing compound having condensed polycyclic hydrocarbon structure, and layer containing conductive material.

NAOYA N, KAZUNORI T, NOSAKA N, TAKANASHI K

Preparation of rare earth modified graphene copper based composite material used for contact line for high speed rail, involves ball milling graphite, organic amine and alcohol substance, centrifuging and separating product, and dissolving copper salt in alcohol substance.

WANG X, HUANG W, XUE D, WONG W

Ultrafast flash Joule heating synthesis method for recovering metal from e.g. ores, fly ash, and bauxite residue, involves applying voltage pulse to mixture, where mass of mixture to which voltage is applied is more than specific kilogram.

TOUR J M, DENG B, DENGBING

Substrate coated with thermal management material comprising thermal conductive coat deposited on substrate, and heat insulation coat comprising plant root powder and resin, used in electronic device e.g. computer and laptop.

ANANDAKRISHNAN S, WU K