国家/地区 美国（5）
IPC部 B（5）
IPC大类 C09（5）
IPC小类 C09D（5）
IPC C09D011/52（3） B33Y010/00（2） B82Y040/00（2）
C01B032/186（2） C01B032/194（2） C09D011/037（2）
C09D011/101（2） H01B005/14（2） H01L021/02（2）
H01L029/16（2） H01L029/66（2） H05K003/12（2）
发明人
公开年 2022（3） 2023（2）
申请年 2022（5）
专利权人

Two-photon polymerization compatible photosensitive ink or resin used in fabricated device including micro/nanoelectronic, battery, optic element, flexible electronic device, printed circuit board, and chip-scale electronic, comprises organic semiconductor, crosslinker, photoinitiator, and solvent.

ABIDIAN M R, DADRASTOUSSI O, KHORRAMI M, MAJD S

Coating substrate by depositing a conductive layer comprising electrically conductive material over substrate, where conductive layer has specific resistivity, and depositing anti-icing layer comprising nanomaterials over conductive layer to form coating system.

KINLEN P J, PRIFTIS D

Digital formation of two-dimensional materials structures used for electronic components, involves generating donor substrates containing back surface and front surface, applying coating to front surface, and irradiating coating containing donor material.

ZERGIOTI I, PAPAZOGLOU S, ZACHARATOS F, LOGOTHETI A, PESQUERA A, ZURUTUZA A, NAVEH D

Transferring one or more nanostructures from one substrate to another substrate by applying coating of crosslinkable copolymer over one or more nanostructures on surface of substrate, heating, transferring nanostructures and copolymer onto another substrate surface, and removing copolymer.

ARNOLD M S, JACOBBERGER R M, GOPALAN P, DWYER J H

Composition for use in three-dimensional printing of electronic devices, comprises at least triphenylamine which is used as a powder binding agent in the composition, where the composition is to be melted and extruded on a structure.

GLENN C M